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| ====== Si wafer dicing ====== | ====== Si wafer dicing ====== | ||
| - | Email exchange | + | 2012: There is a new wafer dicing dystem at OSU - in the Dhagat/ |
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| anything was always a bit of a pain, so I'd try all other options first. | anything was always a bit of a pain, so I'd try all other options first. | ||
| And by all means, use the ones you find around our labs. | And by all means, use the ones you find around our labs. | ||
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| + | //From Chris to Jack//: I'm a grad student working in Janet Tate's group at OSU, and I've recently come across some silicon substrates that were apparently prepared at HP. They are mounted in a circular metal frame, stuck on dicing tape. The wafer was cleaved into many 10*15mm dies with a dicing saw; if you could tell me anything about where they might have come from, who made them, or what I need to do to make my own, it would be very helpful. | ||
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| + | //To Chris from Jack//: All I can help you with is making more. We scribe Si wafers with a UV laser. The kerf width is ~50um and there is a resulting debris field of loose silicon oxides that extends ~100um to either side. The cutting path is entirely up to you but should be rectilinear so as to align with the crystal grain. | ||
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| + | We will need an index to charge to. If you plan on doing this quite a bit you should get badged and trained. Anything less than that I can do for you and you are welcome to join in the fun. | ||
