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| substrate:start [2020/07/01 09:31] – janet | substrate:start [2020/07/03 11:31] (current) – [Cleaving Substrates] janet | ||
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| ====== Cleaving Substrates ====== | ====== Cleaving Substrates ====== | ||
| It is often necessary to cut a substrate or substrate + film into smaller pieces, a process called cleaving. It is easiest to cleave single-crystal substrates along directions that coincide with the major lattice planes, e.g. [100] silicon. Such breaks are typically very clean. Cleaving along random directions is harder. | It is often necessary to cut a substrate or substrate + film into smaller pieces, a process called cleaving. It is easiest to cleave single-crystal substrates along directions that coincide with the major lattice planes, e.g. [100] silicon. Such breaks are typically very clean. Cleaving along random directions is harder. | ||
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| + | Always scribe on the NON-film side of the substrate. Put the film side on a clean, soft, preferably lint-free cloth. | ||
| This video from Okan Agirseven describes cleaving an amorphous SiO2 substrate in the Tate lab: | This video from Okan Agirseven describes cleaving an amorphous SiO2 substrate in the Tate lab: | ||
