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substrate:start [2020/03/06 09:04] – external edit 127.0.0.1substrate:start [2020/07/03 11:31] (current) – [Cleaving Substrates] janet
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-====== Si: Cleaning Procedures that remove the native oxide ======+===== Si: Cleaning Procedures that remove the native oxide =====
  
 This section details some wisdom about cleaning of Si surfaces for the purpose of remove oxides to study reconstructed surfaces or to passivate them. This section details some wisdom about cleaning of Si surfaces for the purpose of remove oxides to study reconstructed surfaces or to passivate them.
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 Today we have had increased success finding LEED patterns by removing a purposefully grown "volatile oxide" layer from the silicon wafer by similarly flashing the wafer to high temperature in vacuum..even seeing some secondary diffraction spots! Our research will probably continue in this direction. i.e. - thermally blasting the si substrates as a final cleaning step. Today we have had increased success finding LEED patterns by removing a purposefully grown "volatile oxide" layer from the silicon wafer by similarly flashing the wafer to high temperature in vacuum..even seeing some secondary diffraction spots! Our research will probably continue in this direction. i.e. - thermally blasting the si substrates as a final cleaning step.
  
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 +====== Cleaving Substrates ====== 
 +It is often necessary to cut a substrate or substrate + film into smaller pieces, a process called cleaving. It is easiest to cleave single-crystal substrates along directions that coincide with the major lattice planes, e.g. [100] silicon. Such breaks are typically very clean. Cleaving along random directions is harder.  Amorphous substrates like glass can also be cleaved, and the edge tends to be less straight, but you get better with practice.  It all depends on the pressure of that single scribe. 
 + 
 +Always scribe on the NON-film side of the substrate. Put the film side on a clean, soft, preferably lint-free cloth. 
 + 
 +This video from Okan Agirseven describes cleaving an amorphous SiO2 substrate in the Tate lab:  
 + 
 +{{ :substrate:okan_agirseven-glass_sample_cleaving_tutorial-2020-06-30.mp4 |Okan describes cleaving}} 
 + 
 +The basic implements are  
 +  * A steel straight-edge ruler 
 +  * A diamond scribe pen 
 +  * Cleaving pliers (which supply a bevel at the scribe position and apply pressure on both sides to break) 
 +A cleaving kit can be purchased from Electron Microscopy Sciences [[https://www.emsdiasum.com/microscopy/products/cleaving/accessories.aspx]] 
 + 
 +This description of the {{ :substrate:cleaving_substrates_for_photonics_com.pdf |cleaving process for single-crystal and amorphous substrates}} comes from Lattice Gear, which also sells cleaving kits.  
 + 
 +University Wafer has a [[https://www.universitywafer.com/cleaving-silicon-wafers.html|website that describes cleaving silicon wafers]] (much easier than amorphous substrates). It has some good images and a fun-to-watch video.

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